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Showing results 1 to 30 of 58

Issue DateTitleAuthor(s)
2008-1122 nm 1:1 line and space patterning by using double patterning and resist reflow process오혜근
2008-0222 nm node contact hole formation in extreme ultra-violet lithography오혜근
2008-0232 nm 1:1 line and space patterning by resist reflow process오혜근
2008-0132 nm 1:1 Line and Space Patterning by Resist Reflow Process오혜근
2007-0232 nm pattern collapse modeling with radial distance and rinse speed오혜근
2007-01Acid Diffusion Length Corresponding to Post Exposure Bake Time and Temperature오혜근
2008-11Acid diffusion length dependency for 32 nm node attenuated and chromeless phase shift mask오혜근
2008-06Aerial Image Characteristics of a Modified Absorber Model for Extreme Ultraviolet Lithography (EUVL)오혜근
2008-06Anisotropic resist reflow process simulation for 22 nm elongated contact holes오혜근
2016-08Anisotropic shadow effects with various pattern directions in an anamorphic high numerical aperture system오혜근
2008-05Application of ellipsometry in immersion lithography오혜근
2017-03Arc-shaped slit effect of EUV lithography with anamorphic high NA system in terms of critical dimension variation오혜근
2017-03CD Error Caused by Aberration and Its Possible Compensation by Optical Proximity Correction in Extreme-Ultraviolet Lithography오혜근
2007-02Characteristics and prevention of pattern collapse in EUV lithography오혜근
2008-02Critical dimension control for 32 nm node random contact hole array using resist reflow process오혜근
2017-09Critical dimension variation caused by wrinkle in extreme ultra-violet pellicle for 3-nm node오혜근
2016-04Eco-friendly photolithography using water-developable pure silk fibroin오혜근
2008-08Ellipsometry for Pellicle-Covered Surface오혜근
2016-03Feasibility of a new absorber material for high NA extreme ultraviolet lithography오혜근
2008-11Haze defects due to pellicle adhesive오혜근
2009-11Heat conduction from hot plate to photoresist on top of wafer including heat loss to the environment오혜근
2008-11Heat conduction to photoresist on top of wafer during post exposure bake process: I. Numerical Approach오혜근
2008-11Heat conduction to photoresist on top of wafer during post exposure bake process:II. Application오혜근
2016-01Impact of a deformed extreme ultraviolet pellicle in terms of the critical dimension uniformity오혜근
2015-07Impact of deformed extreme-ultraviolet pellicle in terms of CD uniformity오혜근
2017-03Impact of non-uniform wrinkles for a multi-stack pellicle in EUV lithography오혜근
2016-05The impact of the residual stress on the EUV pellicle오혜근
2017-01Impact of transmission non-uniformity of a wrinkled EUV pellicle for N5 patterning under various illuminations오혜근
2017-06Influence of a non-ideal sidewall angle of extreme ultra-violet mask absorber for 1×-nm patterning in isomorphic and anamorphic lithography오혜근
2017-10Influence of a wrinkle in terms of critical dimension variation caused by transmission nonuniformity and a particle defect on extreme ultraviolet pellicle오혜근

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