| 2008-12 | SAM modification of CMP conditioner for the prevention of particle adhesion | 박진구 |
| 2013-12 | Scratch formation and its mechanism in chemical mechanical planarization (CMP) | 박진구 |
| 2019-02 | Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning | 박진구 |
| 2019-05 | Selection of CVD Diamond Crystal Size on a CVD Pad Conditioner for Improved Lifetime | 박진구 |
| 2017-01 | Self-assembled monolayer modified MoO3/Au/MoO3 multilayer anodes for high performance OLEDs | 박진구 |
| 2017-01 | Self-assembled monolayer modified MoO3/Au/MoO3 multilayer anodes for high performance OLEDs | 박진구 |
| 2011-05 | A Self-Assembled Monolayer-Based Micropatterned Array for Controlling Cell Adhesion and Protein Adsorption | 박진구 |
| 2013-08 | Shockwave-induced deformation of organic particles during laser shockwave cleaning | 박진구 |
| 2013-08 | Shockwave-induced deformation of organic particles during laser shockwave cleaning | 박진구 |
| 2002-01 | Si Wafer Surface Cleaning Using Laser-induced Shock Wave : A New Dry Cleaing Methodology | 박진구 |
| 2003-06 | Si Wafer Surface Cleaning Using Laser-Induced Shock Wave: A New Dry Cleaning Methodology | 박진구 |
| 2016-02 | Slurry free lapping of silicon wafer for the application of thinning of wafer backside during TSV and packaging | 박진구 |
| 2004-11 | Slurry에 첨가되는 pH 적정제가 Cu CMP에 미치는 영향 분석 | 박진구 |
| 2013-01 | Study of highly selective and sensitive microarray structure based on hydrophilic/hydrophobic SAMS | 박진구 |
| 2019-08 | Study on possible root causes of contamination from an incoming PVA brush during post-CMP cleaning | 박진구 |
| 2022-02 | Study on PVA Brush Loading and Conditioning during Shallow Trench Isolation Post-CMP Cleaning Process | 박진구 |
| 2015-10 | Submicron Particle Removal during FPD Oxide TFT Process | 박진구 |
| 2014-12 | Submicron particle removal during FPD oxide TFT process | 박진구 |
| 2002-11 | Surface Modification of Micromolds by Fluorocarbon Films | 박진구 |
| 2007-10 | Surface preparation in CMP process | 박진구 |
| 2010-09 | Synthesis of Fe metal precipitated colloidal silica and its application to W chemical mechanical polishing (CMP) slurry | 박진구 |
| 2018-12 | The adhesion and removal mechanism of Ceria particles for STI post-CMP cleaning process | 박진구 |
| 2020-06 | The adsorption and removal of corrosion inhibitors during metal CMP | 박진구 |
| 2003-12 | The effect of additives in post-Cu CMP cleaning on particle adhesion and removal | 박진구 |
| 2014-11 | The effect of fluid pH for 2-body lapping process | 박진구 |
| 2006-12 | The effect of frictional and adhesion forces attributed to slurry particles on the surface quality of polished copper | 박진구 |
| 2006-12 | The effect of hydrogen peroxide in a citric acid based copper slurry on Cu polishing | 박진구 |
| 2008-07 | The effect of hydrogen peroxide on frictional and thermal behaviors in a citric acid-based copper chemical mechanical planarization slurry | 박진구 |
| 2012-04 | The effect of pumping methods on wet etching processes | 박진구 |
| 1997-09 | The hydrophilization of process wafers in dilute hydrogen peroxide solutions and ozonated deionized water and its effects on defects and gate oxide integrity | 박진구 |
