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Submicron Particle Removal during FPD Oxide TFT Process

Title
Submicron Particle Removal during FPD Oxide TFT Process
Author
박진구
Issue Date
2015-10
Publisher
Electro chemical society
Citation
ECS Transactions, v. 69, NO 8, Page. 95-100
Abstract
In panel manufacturing processes, cleaning process was not considered to be critical thus far. However, as pixel size is becoming smaller nowadays, the number of pixels per unit area is gradually increasing due to the high resolution. Consequently, an influence of submicron sized contaminated particles is increasing, and hence attention needs to be given to cleaning process. For a large area and high resolution panel with a good production yield, a research on an effective cleaning process which can remove the contaminated particles deposited on the Cu, SiO2 and ITO surfaces is required. Generally, physical cleaning processes are used to remove the submicron particles in FPD (Flat Panel Display) process. In this study, we have optimized these cleaning processes to remove the submicron particles from the substrate surface. Here, we achieved a high cleaning efficiency of above 95% in the EIW megasonic cleaning process on all the substrates.
URI
http://ecst.ecsdl.org/content/69/8/95http://hdl.handle.net/20.500.11754/28240
ISSN
1938-6737; 1938-5862
DOI
10.1149/06908.0095ecst
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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