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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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Results 1-10 of 13 (Search time: 0.001 seconds).
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Issue Date
Title
Author(s)
2012-04
Interface Analysis of Embedded Chip Resistor Device Package and Its Effect on Drop Shock Reliability
김영호
2012-02
Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish
김영호
2012-01
Formation of Ag Nanostrings Induced by Lyotropic Liquid Crystalline Phospholipid Multilayer
김영호
2012-08
Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substrates
김영호
2012-07
Resistive-Switching Memory Effect of Hybrid Structures with Polyimide and SnO2 Nanocrystals
김영호
2012-04
Fabrication of Copper Nanoparticles in a Thick Polyimide Film Cured by Rapid Thermal Annealing
김영호
2012-05
Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)
김영호
2012-04
Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders
김영호
2012-09
칩내장형 PCB 공정을 위한 칩 표면처리 공정에 관한 연구
김영호
2012-10
Resistive switching effect for ZnO hybrid memory with metal-oxide nanocrystals
김영호
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Polyimide
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SnO2
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Adhesion characteristics
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Aging,
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alloys,
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Chip-on-glass (COG) bonding
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Cu Nanoparticles
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Curing
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CURVATURE
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Drop Shock
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