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Fabrication of Copper Nanoparticles in a Thick Polyimide Film Cured by Rapid Thermal Annealing

Title
Fabrication of Copper Nanoparticles in a Thick Polyimide Film Cured by Rapid Thermal Annealing
Author
김영호
Keywords
Cu Nanoparticles; Polyimide; Curing; RTA
Issue Date
2012-04
Publisher
AMER SCIENTIFIC PUBLISHERS
Citation
Journal of nanoscience and nanotechnology, 12, 4, 3637 - 3640
Abstract
We investigated the imidization of a polyimide (PI) and the formation of Cu nanoparticles in a PI film by curinga precursor of PI (polyamic acid (PAA) dissolved in n-methyl-2-pyrrolidinone) in a reducing atmosphere in the rapid thermal annealing (RTA) system. A Cu film was deposited onto the SiO2/Si substrate, and the PAA was spin-coated onto the Cu film. After the PAA reacted with the Cu film, soft-baking was performed to evaporate the solvent. Finally, the PAA was imidized to PI at 450 degrees C by curing in a reducing atmosphere with the RTA. Fourier transform infrared spectroscopy showed that the PAA was successfully imidized by the RTA. X-ray diffraction patterns revealed that Cu nanoparticles formed by RTA curing at 450 degrees C for 5 minutes in a reducing atmosphere, and transmission electron microscopy showed that Cu nanoparticles about 6.5 nm in size were uniformly dispersed in the PI film. Curing by RTA is an attractive method because it takes only a few minutes.
URI
http://www.ingentaconnect.com/content/asp/jnn/2012/00000012/00000004/art00136http://repository.hanyang.ac.kr/handle/20.500.11754/72997
ISSN
1533-4880
DOI
10.1166/jnn.2012.5588
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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