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Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders

Title
Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders
Author
김영호
Keywords
Pb-free solders; Ni-Zn; Under bump metallization; Interfacial reactions; Microstructure
Issue Date
2012-04
Publisher
Elsevier Science B.V., Amsterdam.
Citation
Journal of Alloys and Compounds, Sep 2012, 535, P.33-38
Abstract
We developed a new sputtered under bump metallurgy (UBM) based on Ni-20wt% Zn thin films for Pb-free solders. This study focuses on the interfacial reactions between two Pb-free solders (Sn3.0Ag0.5Cu and Sn1.0Ag0.7Cu) and a Ni-Zn alloy UBM. By adding Zn to Ni UBM, Zn is incorporated into intermetallic compounds (IMCs) to form a quaternary Cu-Ni-Zn-Sn phase at the solder/Ni-Zn interface after reflow and subsequent isothermal aging. The Ni-Zn UBM sufficiently reduces the interfacial reaction and IMCs formation rates as well as UBM consumption rates compared to a Ni UBM. In particular, the formation of (Ni, Cu)(3)Sn-4 IMC was significantly retarded by adding Zn into UBM. (C) 2012 Elsevier B.V. All rights reserved.
URI
https://www.sciencedirect.com/science/article/pii/S0925838812007268?via%3Dihubhttp://hdl.handle.net/20.500.11754/49752
ISSN
0925-8388
DOI
10.1016/j.jallcom.2012.04.062
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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