| 2014-05 | Effect of La doping of ceria abrasives for STI CMP | 박진구 |
| 2013-12 | Effect of La doping of ceria abrasives for STI CMP | 박진구 |
| 2015-02 | Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation | 박진구 |
| 2015-05 | Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation | 박진구 |
| 2008-12 | Effect of laser shock wave cleaning direction on particle removal behavior at trenchs | 박진구 |
| 2002-10 | The Effect of Mechanical Properties of Polishing Pads on Oxide CMP | 박진구 |
| 2009-02 | Effect of O-2 Pretreatment on Fluorinated Carbon Film Surfaces | 박진구 |
| 2002-03 | Effect of Organic Acids in Copper Chemical Mechanical Planarization Slurry on Slurry Stability and Particle Contamination on Copper Surfaces | 박진구 |
| 2018-10 | Effect of organic acids in dilute HF solutions on removal of metal contaminants on silicon wafer | 박진구 |
| 2018-10 | Effect of organic acids in dilute HF solutions on removal of metal contaminants on silicon wafer | 박진구 |
| 2008-12 | Effect of Ozone Supply Methods on PRE in Alkaline Ozone Solutions | 박진구 |
| 2015-10 | Effect of Particle Contamination on Extreme Ultraviolet (EUV) Mask and Megasonic Cleaning Process for Its Removal | 박진구 |
| 2014-12 | Effect of particle contamination on extreme ultraviolet (EUV) mask and megasonic cleaning process for its removal | 박진구 |
| 2007-10 | Effect of particle deposition and wet/dry cleaning methods on particle removal efficiency | 박진구 |
| 2016-05 | Effect of pH and chemical mechanical planarization process conditions on the copper-benzotriazole complex formation | 박진구 |
| 2016-06 | Effect of pH and chemical mechanical planarization process conditions on the copper-benzotriazole complex formation | 박진구 |
| 2009-01 | Effect of pH in Ru Slurry with Sodium Periodate on Ru CMP | 박진구 |
| 2006-12 | Effect of polish by-products on copper chemical mechanical polishing behavior | 박진구 |
| 2006-12 | Effect of poly silicon wettability on polymeric residue contamination | 박진구 |
| 2009-10 | Effect of Polysilicon Wettability on Polishing and Organic Defects during CMP | 박진구 |
| 2010-02 | Effect of Processing Parameters, Antistiction Coatings, and Polymer Type when Injection Molding Microfeatures | 박진구 |
| 2011-10 | Effect of Pump Pulsation on Particle Contamination on Wafer Surface in Wet Cleaning System | 박진구 |
| 2010-12 | Effect of pump pulsation on particle contamination on wafer surface in wet cleaning system | 박진구 |
| 2011-01 | Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development | 박진구 |
| 2011-01 | Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development | 박진구 |
| 2011-01 | Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development | 박진구 |
| 2014-01 | Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical-Mechanical Polishing | 박진구 |
| 2014-03 | Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical-Mechanical Polishing | 박진구 |
| 2022-05 | Effect of Skin Layer on Brush Loading, Cross-Contamination, and Cleaning Performance during Post-CMP Cleaning | 박진구 |
| 2022-08 | Effect of Slurry Additives on Co-BTA Complex Stability and Inhibition Property During Co CMP Process | 박진구 |
