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Effect of Pump Pulsation on Particle Contamination on Wafer Surface in Wet Cleaning System

Title
Effect of Pump Pulsation on Particle Contamination on Wafer Surface in Wet Cleaning System
Author
박진구
Keywords
Diaphragm pumps; Experimental investigations; On-wafer; Particle contamination; Pump pulsations; Pumping methods; Single wafer; Wafer cleaning; Wet cleaning
Issue Date
2011-10
Publisher
Pennington, N.J.; Electrochemical Society
Citation
ECS Transactions, Semiconductor Cleaning Science and Technology 12, SCST 12. ECS Transactions 2011, 41(5),221-227
Abstract
The effects of pumping method on wafer cleaning were investigated. Two types of pump such as diaphragms and centrifugal were used for circulation and supply of DI water for wafer cleaning in both wet bath and single wafer tool. The cleaning studies show that the pumping methods have a great influence on cleaning performance. The experimental investigations reveal that the number of added particles on the wafer during wafer cleaning is much lesser in MLC pump (non-pulsation flow) than the both diaphragm pumps (pulsation flow).
URI
http://ecst.ecsdl.org/content/41/5/221
ISSN
1938-5862; 1938-6737
DOI
10.1149/1.3630847
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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