| 2013-02 | Characterization of TMAH based cleaning solution for post Cu-CMP application | 박진구 |
| 2004-02 | Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance | 박진구 |
| 2007-04 | Chemical and nanomechanical characteristics of fluorocarbon thin films deposited by using plasma enhanced chemical vapor deposition | 박진구 |
| 2000-11 | Chemical, optical and tribological characterization of perfluoropolymer films as an anti-stiction layer in micro-mirror arrays | 박진구 |
| 2021-12 | Chemically controlled megasonic cleaning of patterned structures using solutions with dissolved gas and surfactant | 박진구 |
| 2011-08 | Citric Acid and NaIO(4) Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning | 박진구 |
| 2011-08 | Citric Acid and NaIO4 Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning | 박진구 |
| 2012-03 | CMP defects | 박진구 |
| 2011-12 | CMP defects | 박진구 |
| 2004-07 | CMP 공정중 전기화학적 방법과 마찰력을 이용하여 Cu Wafer와 Disc의 특성 비교 | 박진구 |
| 2010-01 | Collapse behavior and forces of multistack nanolines | 박진구 |
| 2020-10 | Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process | 박진구 |
| 2015-06 | Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size | 박진구 |
| 2015-05 | Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size | 박진구 |
| 2018-04 | Conductive and transparent submicron polymer lens array fabrication for electrowetting applications | 박진구 |
| 2017-12 | Conductive and transparent submicron polymer lens array fabrication for electrowetting applications | 박진구 |
| 2020-12 | Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process | 박진구 |
| 2009-10 | Convective Assembly and Dry Transfer of Nanoparticles Using Hydrophobic/Hydrophilic Monolayer Templates | 박진구 |
| 2011-12 | Correlation of polishing pad property and pad debris on scratch formation during CMP | 박진구 |
| 2017-09 | Critical dimension variation caused by wrinkle in extreme ultra-violet pellicle for 3-nm node | 박진구 |
| 2017-10 | Critical dimension variation caused by wrinkle in extreme ultra-violet pellicle for 3-nm node | 박진구 |
| 2004-07 | Cu CMP에서 Large sized particles이 연마속도에 미치는 영향 | 박진구 |
| 2001-11 | Cu CMP에서 첨가제가 Polishing에 미치는 영향 | 박진구 |
| 2007-12 | Cu ECMP 공정에서 전해액이 연마거동에 미치는 영향 | 박진구 |
| 2005-11 | Cu Oxide와 Silicon Tip 사이의 나노트라이볼러지 작용 | 박진구 |
| 2004-12 | Cu post-CMP cleaning and the effect of additives | 박진구 |
| 2007-11 | Damage free particle removal from EUVL mask layers by high energy laser shock cleaning (LSC) | 박진구 |
| 2008-06 | Damage free particle removal from extreme ultraviolet lithography mask layers by high energy laser shock wave cleaning | 박진구 |
| 2005-06 | The Deposition and Characterization of 10nm Thick Teflon-like Anti-stiction Films for the Hot Embossing | 박진구 |
| 2006-12 | Deposition and characterization of antistiction layer for nanoimprint lithography by VSAM (Vapor Self Assembly Monolayer) | 박진구 |
