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The Deposition and Characterization of 10nm Thick Teflon-like Anti-stiction Films for the Hot Embossing

Title
The Deposition and Characterization of 10nm Thick Teflon-like Anti-stiction Films for the Hot Embossing
Other Titles
핫 엠보싱용 점착방지막으로 사용되는 10nm급 두께의 Teflon-like 박막의 형성 및 특성평가
Author
박진구
Keywords
nanoimprinting hot embossing; anti-stiction layer; chemical vapor deposition; AFM/LFM
Issue Date
2005-06
Publisher
한국재료학회
Citation
한국재료학회지, v. 15, No. 3, Page. 149-154
Abstract
Teflon like fluorocarbon thin films have been deposited on silicon and oxide molds as an antistiction layer for the hot embossing process by an inductively coupled plasma (ICP) chemical vapor deposition (CVD) method. The process was performed at C4F8 C4F8 gas flow rate of 2 sccm and 30 W of plasma power as a function of substrate temperature. The thickness of film was measured by a spectroscopic ellipsometry. These films were left in a vacuum oven of 100, 200 and 300∘C 300∘C for a week. The change of film thickness, contact angle and adhesion and friction force was measured before and after the thermal test. No degradation of film was observed when films were treated at 100∘C 100∘C . The heat treatment of films at 200 and 300∘C 300∘C caused the reduction of contact angles and film thickness in both silicon and oxide samples. Higher adhesion and friction forces of films were also measured on films treated at higher temperatures than 100∘C 100∘C . No differences on film properties were found when films were deposited on either silicon or oxide. A 100 nm silicon template with 1 to 500μm 500μm patterns was used for the hot embossing process on 4.5μm 4.5μm thick PMMA spun coated silicon wafers. The antistiction layer of 10 nm was deposited on the silicon mold. No stiction or damages were found on PMMA surfaces even after 30 times of hot embossing at 200∘C 200∘C and 10 kN.
URI
http://www.koreascience.or.kr/article/JAKO200502612633302.pagehttp://repository.hanyang.ac.kr/handle/20.500.11754/110894
ISSN
1225-0562; 2287-7258
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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