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Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size

Title
Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size
Author
박진구
Keywords
Lapping; Sapphire; Fixed abrasive pad; Diamond; Metal-resin platen
Issue Date
2015-06
Publisher
ELSEVIER SCIENCE SA
Citation
WEAR, v. 332, NO Special SI, Page. 794-799
Abstract
Lapping for sapphire substrates was evaluated with respect to material removal modes. Firstly, a 3-body removal mode that consists of diamond slurry and a metal-resin platen was tested. The metal-resin platen was produced by mixing metal particles (Cu, Al, and Sn) and resin. Secondly, we analyzed a 2-body system using a fixed diamond abrasive pad with a low concentration of alumina slurry as a dressing for the pad surface. For each lapping process, we examined the function of the diamond abrasive particles. The fundamental characteristics of each process were observed to suggest optimal conditions for sapphire processing for various applications. (C) 2015 Elsevier B.V. All rights reserved.
URI
http://www.sciencedirect.com/science/article/pii/S0043164815001386http://hdl.handle.net/20.500.11754/25676
ISSN
0043-1648; 1873-2577
DOI
10.1016/j.wear.2015.02.029
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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