A 6-18-GHz GaN Reactively Matched Distributed Power Amplifier Using Simplified Bias Network and Reduced Thermal Coupling
- Title
- A 6-18-GHz GaN Reactively Matched Distributed Power Amplifier Using Simplified Bias Network and Reduced Thermal Coupling
- Author
- 김정현
- Keywords
- Broadband amplifier; distributed amplifier (DA); GaN monolithic microwave integrated circuit (MMIC); multioctave; power amplifier (PA)
- Issue Date
- 2018-06
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Citation
- IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v. 66, No. 6, Page. 2638-2648
- Abstract
- Two-stage reactively matched gain cells are proposed to implement a high-gain multioctave distributed power amplifier (DPA). The proposed reactively matched distributed amplifier (RMDA) structure shows high gain and power in a small die size. Detailed analysis is presented to understand the design criteria for interstage matching of reactively matched cells. A shared dc bias network is proposed to simplify the biasing of each section to reduce the DPA die size. The thermal coupling effect of GaN high-power amplifier is minimized by optimizing the chip layout. The theoretical analysis is verified by the simulation and supported by the measured data. Two RMDAs are fabricated with a commercial 0.25-mu m GaN HEMT process. The implemented RMDA with the compact transistor layout has been implemented in a small die size of 10.7 mm(2) and shows output powers reaching 40.3-43.9 dBm, power added efficiencies (PAEs) of 16-27%, and small-signal gains of 15.3-23.2 dB. The RMDA with the reduced thermal coupling achieves 40.6-43.4 dBm with a peak PAE of 29% in a slightly larger die size of 13.8 mm(2). To the best of our knowledge, this is the first demonstration of a GaN DPA using reactively matched gain cells, showing very high gain and efficiency over multioctave bandwidth in a small die size.
- URI
- https://ieeexplore.ieee.org/abstract/document/8330036https://repository.hanyang.ac.kr/handle/20.500.11754/81159
- ISSN
- 0018-9480
- DOI
- 10.1109/TMTT.2018.2817521
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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