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COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)
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Results 11-20 of 88 (Search time: 0.002 seconds).
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Issue Date
Title
Author(s)
2004-02
Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance
박진구
2004-02
A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process
박진구
2005-07
Polishing Behavior and Characterization of Cu Surface in Citric Acid based Slurry with Corrosion Inhibitor(BTA)
박진구
2005-06
Fabrication of metal line on plastic substrate by hot embossing and CMP process
박진구
2003-04
나노 Imprinting 을 위한 몰드 제작에 관한 연구
박진구
2004-11
Slurry에 첨가되는 pH 적정제가 Cu CMP에 미치는 영향 분석
박진구
2004-11
The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal
박진구
2003-05
Interaction Forces Between Silica Particles and Wafer Surfaces during Chemical Mechanical Planarization of Copper
박진구
2004-07
CMP 공정중 전기화학적 방법과 마찰력을 이용하여 Cu Wafer와 Disc의 특성 비교
박진구
2004-07
In-Situ Characterization of Electrochemical and Frictional Behaviors During Copper CMP
박진구
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CMP
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Cu CMP
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adhesion force
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AFM/LFM
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Anti-stiction layer
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BTA
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Chemical mechanical planarization...
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Etch rate
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Hot Embossing
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2009
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