The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal
- Title
- The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal
- Author
- 박진구
- Issue Date
- 2004-11
- Publisher
- ELECTROCHEMICAL SOC INC
- Citation
- JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, Issue.11, Page.G756-B761
- Abstract
- The adhesion force of silica particles to Cu films and the role of additives on adhesion and removal of particles have been
theoretically and experimentally investigated in citric-acid-based post-Cu chemical mechanical planarization ~CMP! cleaning
solutions. The zeta potential of silica and Cu slightly increases when citric acid is added due to the adsorption of citrates. Citric
acid is adsorbed on silica and Cu surfaces, resulting in more negative charges on these surfaces. The adhesion force of silica
particles on Cu decreases as the citric acid concentration increases due to more repulsive electrostatic interaction between surfaces.
The addition of benzotriazole in the cleaning solution initially decreases adhesion then increases it at high concentrations due to
the change in zeta potentials. The addition of tetramethylammonium hydroxide to citric acid increases the particle adhesion force.
However, the addition of NH4OH results in the lowest adhesion forces. The highest particle removal efficiency is observed when
using cleaning solutions that yield the lowest adhesion force.
- URI
- https://www.scopus.com/record/display.uri?eid=2-s2.0-10944264681&origin=inward&txGid=732664b4e1481a4599c6e79c37b16252https://repository.hanyang.ac.kr/handle/20.500.11754/155024
- ISSN
- 00134651
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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