In-Situ Characterization of Electrochemical and Frictional Behaviors During Copper CMP
- Title
- In-Situ Characterization of Electrochemical and Frictional Behaviors During Copper CMP
- Author
- 박진구
- Keywords
- Cu CMP; Organic acids; corrosion potential and current; Preston equation; friction force; Stribeck curve
- Issue Date
- 2004-07
- Publisher
- 한국전기전자재료학회
- Citation
- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집), Pages. 227-230
- Abstract
- As the organic acids were added in the slurry, zeta potential of alumina was changed to negative value and IEP value was shifted from alkaline to acidic pH. In citric acid based slurry, Cu surface continuously dissolved and etching depth linearly increased. On the contrary, passivation layer was grown on Cu surface in oxalic acid based slurry. As the platen rotation speed increased, Preston coefficient decreased in both slurries. With oxalic acid based slurry, at low velocity, removal rate is high value because of high friction force compared to citric acid based slurry. As platen velocity increased, removal of Cu in citric acid based slurry became higher value than oxalic acid based slurry. Typical lubrication behaviors were observed in both slurries. As Sommerfeld number increased, COF values gradually decreased and then re-increased. It indicated that lubrication was changed to direct contact or semi-direct contact mode to hydro-lubrication mode.
- URI
- http://www.koreascience.or.kr/article/CFKO200421138182348.pagehttps://repository.hanyang.ac.kr/handle/20.500.11754/151321
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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