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Effects of pump-induced particle agglomeration during chemical mechanical planarization (CMP)

Title
Effects of pump-induced particle agglomeration during chemical mechanical planarization (CMP)
Author
박진구
Issue Date
2014-11
Publisher
Institute of Electrical and Electronics Engineers Inc.
Citation
ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014, article no. 7017293, Page. 254-258
Abstract
In this study, the effects of large particle in chemical mechanical planarization (CMP) slurry were investigated on slurry distribution system, which utilizes a pumping device to circulate CMP slurry. Three different types of pumps (e.g., bellows, diaphragm and magnetically levitated centrifugal pump) were evaluated their performance such as generation of agglomerated particle and defectivity in different of slurries (Ceria slurry, Silica slurry a, Silica slurry b). © 2014 IEEE.
URI
https://ieeexplore.ieee.org/document/7017293https://repository.hanyang.ac.kr/handle/20.500.11754/181185
DOI
10.1109/ICPT.2014.7017293
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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