Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2023-05-24T00:30:58Z | - |
dc.date.available | 2023-05-24T00:30:58Z | - |
dc.date.issued | 2014-11 | - |
dc.identifier.citation | ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014, article no. 7017293, Page. 254-258 | - |
dc.identifier.uri | https://ieeexplore.ieee.org/document/7017293 | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/181185 | - |
dc.description.abstract | In this study, the effects of large particle in chemical mechanical planarization (CMP) slurry were investigated on slurry distribution system, which utilizes a pumping device to circulate CMP slurry. Three different types of pumps (e.g., bellows, diaphragm and magnetically levitated centrifugal pump) were evaluated their performance such as generation of agglomerated particle and defectivity in different of slurries (Ceria slurry, Silica slurry a, Silica slurry b). © 2014 IEEE. | - |
dc.description.sponsorship | This research was supported by Basic Science Research Program through the National Research Foundation of Korea(NRF) funded by the Ministry of Science, ICT & Future Planning(No. 2008-0061891) | - |
dc.language | en | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | Effects of pump-induced particle agglomeration during chemical mechanical planarization (CMP) | - |
dc.type | Article | - |
dc.identifier.doi | 10.1109/ICPT.2014.7017293 | - |
dc.relation.page | 254-258 | - |
dc.relation.journal | ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014 | - |
dc.contributor.googleauthor | Seo, Young gil | - |
dc.contributor.googleauthor | Elaiyaraju, Periyasamy | - |
dc.contributor.googleauthor | Park, Jin-Goo | - |
dc.sector.campus | E | - |
dc.sector.daehak | 공학대학 | - |
dc.sector.department | 재료화학공학과 | - |
dc.identifier.pid | jgpark | - |
dc.identifier.article | 7017293 | - |
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