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dc.contributor.author박진구-
dc.date.accessioned2023-05-24T00:30:58Z-
dc.date.available2023-05-24T00:30:58Z-
dc.date.issued2014-11-
dc.identifier.citationICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014, article no. 7017293, Page. 254-258-
dc.identifier.urihttps://ieeexplore.ieee.org/document/7017293en_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/181185-
dc.description.abstractIn this study, the effects of large particle in chemical mechanical planarization (CMP) slurry were investigated on slurry distribution system, which utilizes a pumping device to circulate CMP slurry. Three different types of pumps (e.g., bellows, diaphragm and magnetically levitated centrifugal pump) were evaluated their performance such as generation of agglomerated particle and defectivity in different of slurries (Ceria slurry, Silica slurry a, Silica slurry b). © 2014 IEEE.-
dc.description.sponsorshipThis research was supported by Basic Science Research Program through the National Research Foundation of Korea(NRF) funded by the Ministry of Science, ICT & Future Planning(No. 2008-0061891)-
dc.languageen-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleEffects of pump-induced particle agglomeration during chemical mechanical planarization (CMP)-
dc.typeArticle-
dc.identifier.doi10.1109/ICPT.2014.7017293-
dc.relation.page254-258-
dc.relation.journalICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014-
dc.contributor.googleauthorSeo, Young gil-
dc.contributor.googleauthorElaiyaraju, Periyasamy-
dc.contributor.googleauthorPark, Jin-Goo-
dc.sector.campusE-
dc.sector.daehak공학대학-
dc.sector.department재료화학공학과-
dc.identifier.pidjgpark-
dc.identifier.article7017293-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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