A via is experimentally characterized by using
high-frequency s-parameter measurements. Test patterns
are designed and fabricated by using a package
process. They are measured by using VNA (vector
network analyzer) up to 25GHz. The parasitic effects
due to access lines for on-wafer probing are deembedded.
Then modeling the via as T-type circuit,
the circuit model parameters are determined. It is
shown that the proposed technique has excellent
agreement with the measured s-parameters.