다층 배선 비아(Via)의 고주파 측정 기반 회로 모델링

Abstract

A via is experimentally characterized by using high-frequency s-parameter measurements. Test patterns are designed and fabricated by using a package process. They are measured by using VNA (vector network analyzer) up to 25GHz. The parasitic effects due to access lines for on-wafer probing are deembedded. Then modeling the via as T-type circuit, the circuit model parameters are determined. It is shown that the proposed technique has excellent agreement with the measured s-parameters.