2017년도 대한전기학회 창립 70주년 제48회 하계학술대회, Page. 1155-1156
Abstract
In
this
study,
embedded-type
transparent
copper
(Cu)
mesh
electrodes
for
flexible
applications
were
fabricated
via
solution
process.
The
Cu
layer
was
deposited
on
PET
substrates
using
an
electroless
plating
method
and
the
mesh
was
patterned
by
lithography.
The
Cu
meshes
were
embedded
using
a
hot
press
machine
by
changing
the
pressure
and
press
time.
The
embedded
depth
of
the
Cu
meshes
was
measured
by
α
-step.
The
transmittance
and
sheet
resistance
of
the
fabricated
Cu
mesh
electrodes
were
measured
using
a
UV-vis
spectrophotometer
and
a
non-contact
sheet
resistance
measurement
equipment,
respectively,
before
and
after
hot
pressing.