Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진석 | - |
dc.date.accessioned | 2019-05-07T04:38:13Z | - |
dc.date.available | 2019-05-07T04:38:13Z | - |
dc.date.issued | 2017-07 | - |
dc.identifier.citation | 2017년도 대한전기학회 창립 70주년 제48회 하계학술대회, Page. 1155-1156 | en_US |
dc.identifier.uri | http://www.dbpia.co.kr/Journal/ArticleDetail/NODE07232552 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/103478 | - |
dc.description.abstract | In this study, embedded-type transparent copper (Cu) mesh electrodes for flexible applications were fabricated via solution process. The Cu layer was deposited on PET substrates using an electroless plating method and the mesh was patterned by lithography. The Cu meshes were embedded using a hot press machine by changing the pressure and press time. The embedded depth of the Cu meshes was measured by α -step. The transmittance and sheet resistance of the fabricated Cu mesh electrodes were measured using a UV-vis spectrophotometer and a non-contact sheet resistance measurement equipment, respectively, before and after hot pressing. | en_US |
dc.language.iso | ko_KR | en_US |
dc.publisher | 대한전기학회 | en_US |
dc.title | 용액 공정에 의한 기판 삽입형 투명전극 제작 | en_US |
dc.title.alternative | Fabrication of embedded-type transparent electrodes via solution process | en_US |
dc.type | Article | en_US |
dc.relation.page | 1155-1156 | - |
dc.contributor.googleauthor | 유리아 | - |
dc.contributor.googleauthor | 박종설 | - |
dc.contributor.googleauthor | 김부종 | - |
dc.contributor.googleauthor | 최준하 | - |
dc.contributor.googleauthor | 박진석 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DIVISION OF ELECTRICAL ENGINEERING | - |
dc.identifier.pid | jinsp | - |
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