Assessment of Appropriate MMC Topology Considering DC Fault Handling Performance of Fault Protection Devices
- Title
- Assessment of Appropriate MMC Topology Considering DC Fault Handling Performance of Fault Protection Devices
- Author
- 이방욱
- Keywords
- half bridge (HB); full bridge (FB); modular multilevel converter (MMC); hybrid HVDC breaker (HCB); HVDC
- Issue Date
- 2018-10
- Publisher
- MDPI AG
- Citation
- APPLIED SCIENCES-BASEL, v. 8, No. 10, Article no. 1834
- Abstract
- The eventual goal of high-voltage direct-voltage (HVDC) systems is to implement HVDC grids. The modular multilevel converter (MMC) has been identified as the best candidate for the realization of an HVDC grid by eliminating the shortcomings of conventional voltage source converter (VSC) technology. The related research has focused on efficient control schemes, new MMC topologies, and operational characteristics of an MMC in a DC grid, but there is little understanding about the fault handling capability of two mainstream MMC topologies, i.e., half bridge (HB) and full bridge (FB) MMCs in combination with an adequate protection device. Contrary to the existing research where the fault location is usually fixed (center of the line), this paper considered a variable fault location on the DC line, so as to compare the fault interruption time and maximum fault current magnitude. From the point of view of fault interruption, AC and DC side transient analyses were performed for both MMC topologies to suggest the appropriate topology. The simulation result confirmed that the fault handling performance of an HB-MMC with a DC circuit breaker is superior due to the smaller fault current magnitude, faster interruption time, lower overvoltage magnitude, and lesser stresses on the insulation of the DC grid.
- URI
- https://www.mdpi.com/2076-3417/8/10/1834/htmhttps://repository.hanyang.ac.kr/handle/20.500.11754/81430
- ISSN
- 2076-3417
- DOI
- 10.3390/app8101834
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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