Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application
- Title
- Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application
- Author
- 김영호
- Keywords
- Flip-chip devices,; Joints; Tin; Reliability; Bonding; Moisture; Silicon compounds
- Issue Date
- 2013-05
- Publisher
- IEEE
- Citation
- IEEE 63rd Electronic Components and Technology Conference, 2013, P.785-789
- Abstract
- A 20 μm pitch flip-chip bonding with Sn/Cu bumps and nonconductive adhesives (NCAs) was developed to satisfy the requirement for high density electronic packaging. The Sn/Cu bumps of a 20 μm pitch are peripheral distributed in a line. The bonding process was performed at 150°C for 10 s using three commercial NCAs. All the joints were successfully fabricated with NCAs, and have similar contact resistance values, regardless of NCA type. To evaluate the reliability, a thermal cycling (T/C) test (-55°C/125°C, 1000 cycles) and a temperature and humidity (T&H) test (70°C/95% RH, 1000 h) were performed. The effect of NCA type on reliability was investigated. NCA, which has lower moisture absorption and a lower coefficient of thermal expansion, had the best performance in a reliability test. Our results showed that bonding using Sn/Cu bumps and NCA can be applied in ultra-fine pitch (less than 20 μm) flip-chip bonding if the proper NCA is selected.
- URI
- https://ieeexplore.ieee.org/document/6575662/https://repository.hanyang.ac.kr/handle/20.500.11754/71086
- ISBN
- 978-1-4799-0233-0; 978-1-4799-0232-3
- ISSN
- 0569-5503
- DOI
- 10.1109/ECTC.2013.6575662
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
- Files in This Item:
There are no files associated with this item.
- Export
- RIS (EndNote)
- XLS (Excel)
- XML