Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics
- Title
- Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics
- Other Titles
- microparticles ink via flash light sintering for printed electronics
- Author
- 김학성
- Keywords
- flash light sintering; copper nanoparticles
- Issue Date
- 2014-06
- Publisher
- IOP PUBLISHING LTD
- Citation
- NANOTECHNOLOGY, 25(26), p.1-11(11pages)
- Abstract
- In this study, the size effect of copper particles on the flash light sintering of copper (Cu) ink was investigated using Cu nanoparticles (20-50 nm diameter) and microparticles (2 mu m diameter). Also, the mixed Cu nano-/micro-inks were fabricated, and the synergetic effects between the Cu nano-ink and micro-ink on flash light sintering were assessed. The ratio of nanoparticles to microparticles in Cu ink and the several flash light irradiation conditions (irradiation energy density, pulse number, on-time, and off-time) were optimized to obtain high conductivity of Cu films. In order to precisely monitor the milliseconds-long flash light sintering process, in situ monitoring of electrical resistance and temperature changes of Cu films was conducted during the flash light irradiation using a real-time Wheatstone bridge electrical circuit, thermocouple-based circuit, and a high-rate data acquisition system. Also, several microscopic and spectroscopic characterization techniques such as scanning electron microscopy, x-ray diffraction, x-ray photoelectron spectroscopy, and Fourier transform infrared spectroscopy were used to characterize the flash light sintered Cu nano-/micro-films. In addition, the sheet resistance of Cu film was measured using a four-point probe method. This work revealed that the optimal ratio of nanoparticles to microparticles is 50:50 wt%, and the optimally fabricated and flash light sintered Cu nano-/micro-ink films have the lowest resistivity (80 mu Omega cm) among nanoink, micro-ink, or nano-micro mixed films.
- URI
- http://iopscience.iop.org/article/10.1088/0957-4484/25/26/265601/metahttp://hdl.handle.net/20.500.11754/54723
- ISSN
- 0957-4484; 1361-6528
- DOI
- 10.1088/0957-4484/25/26/26560
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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