Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김학성 | - |
dc.date.accessioned | 2018-04-02T02:06:35Z | - |
dc.date.available | 2018-04-02T02:06:35Z | - |
dc.date.issued | 2014-06 | - |
dc.identifier.citation | NANOTECHNOLOGY, 25(26), p.1-11(11pages) | en_US |
dc.identifier.issn | 0957-4484 | - |
dc.identifier.issn | 1361-6528 | - |
dc.identifier.uri | http://iopscience.iop.org/article/10.1088/0957-4484/25/26/265601/meta | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/54723 | - |
dc.description.abstract | In this study, the size effect of copper particles on the flash light sintering of copper (Cu) ink was investigated using Cu nanoparticles (20-50 nm diameter) and microparticles (2 mu m diameter). Also, the mixed Cu nano-/micro-inks were fabricated, and the synergetic effects between the Cu nano-ink and micro-ink on flash light sintering were assessed. The ratio of nanoparticles to microparticles in Cu ink and the several flash light irradiation conditions (irradiation energy density, pulse number, on-time, and off-time) were optimized to obtain high conductivity of Cu films. In order to precisely monitor the milliseconds-long flash light sintering process, in situ monitoring of electrical resistance and temperature changes of Cu films was conducted during the flash light irradiation using a real-time Wheatstone bridge electrical circuit, thermocouple-based circuit, and a high-rate data acquisition system. Also, several microscopic and spectroscopic characterization techniques such as scanning electron microscopy, x-ray diffraction, x-ray photoelectron spectroscopy, and Fourier transform infrared spectroscopy were used to characterize the flash light sintered Cu nano-/micro-films. In addition, the sheet resistance of Cu film was measured using a four-point probe method. This work revealed that the optimal ratio of nanoparticles to microparticles is 50:50 wt%, and the optimally fabricated and flash light sintered Cu nano-/micro-ink films have the lowest resistivity (80 mu Omega cm) among nanoink, micro-ink, or nano-micro mixed films. | en_US |
dc.description.sponsorship | This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education 2012R1A6A1029029). This work was supported by a National Research Foundation of Korea (NRF) grant funded by the Korean government (MEST) (No. 2013M2A2A9043280). We would like to acknowledge the financial support from the R&D Convergence Program of MSIP (Ministry of Science, ICT and Future Planning) and ISTK (Korea Research Council for Industrial Science and Technology) of Republic of Korea (Grant B551179-13-02-05). This research was also supported by a grant from the Technology Development Program for Strategic Core Materials funded by the Ministry of Trade, Industry & Energy, Republic of Korea (Project No. 10047758). | en_US |
dc.language.iso | en | en_US |
dc.publisher | IOP PUBLISHING LTD | en_US |
dc.subject | flash light sintering | en_US |
dc.subject | copper nanoparticles | en_US |
dc.title | Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics | en_US |
dc.title.alternative | microparticles ink via flash light sintering for printed electronics | en_US |
dc.type | Article | en_US |
dc.relation.no | 26 | - |
dc.relation.volume | 25 | - |
dc.identifier.doi | 10.1088/0957-4484/25/26/26560 | - |
dc.relation.page | 1-11 | - |
dc.relation.journal | NANOTECHNOLOGY | - |
dc.contributor.googleauthor | Joo, Sung-Jun | - |
dc.contributor.googleauthor | Hwang, Hyun-Jun | - |
dc.contributor.googleauthor | Kim, Hak-Sung | - |
dc.relation.code | 2014036389 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | kima | - |
dc.identifier.orcid | http://orcid.org/0000-0002-6076-6636 | - |
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