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COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)
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Results 21-30 of 264 (Search time: 0.004 seconds).
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Issue Date
Title
Author(s)
2005-06
Fabrication of plastic CE(capillary electrophoresis) microchip by hot embossing process
박진구
2005-10
Nanoscale Particles Removal on an Extreme Ultra-Violet Lithography(EUVL) Mask Layer by Lasershock Cleaning
박진구
2005-10
The Effects of pH Adjustors in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal
박진구
2019-08
Study on possible root causes of contamination from an incoming PVA brush during post-CMP cleaning
박진구
2004-02
Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance
박진구
2004-02
A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process
박진구
2019-06
A Breakthrough Method for the Effective Conditioning of PVA Brush Used for Post-CMP Process
박진구
2005-07
Polishing Behavior and Characterization of Cu Surface in Citric Acid based Slurry with Corrosion Inhibitor(BTA)
박진구
2005-06
Fabrication of metal line on plastic substrate by hot embossing and CMP process
박진구
2019-09
Ultrasound-induced break-in method for an incoming polyvinyl acetal (PVA) brush used during post-CMP cleaning process
박진구
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CMP
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Particle removal
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Post CMP cleaning
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Cu CMP
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Megasonic cleaning
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Chemical mechanical planarization...
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Removal rate
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AFM
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Benzotriazole
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