Fabrication of plastic CE(capillary electrophoresis) microchip by hot embossing process
- Title
- Fabrication of plastic CE(capillary electrophoresis) microchip by hot embossing process
- Other Titles
- 핫 엠보싱 공정을 이용한 플라스틱 CE(capillary electrophoresis) 마이크로 칩의 제작
- Author
- 박진구
- Keywords
- Nanoimprint; Hot Embossing; Capillary Electrophoresis; Plastic Chip
- Issue Date
- 2005-06
- Publisher
- 한국정밀공학회
- Citation
- 2005 Proceedings of the Korean Society of Precision Engineering Conference, Page. 1140-1144
- Abstract
- A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.
- URI
- http://www.koreascience.or.kr/article/CFKO200522219647703.viewhttps://repository.hanyang.ac.kr/handle/20.500.11754/110889
- ISSN
- 2005-8446
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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