2010-12 | Nano gas cluster dry cleaning for damage free particle removal | 박진구 |
2020-03 | Nanocatalyst-induced hydroxyl radical (·OH) slurry for tungsten CMP for next-generation semiconductor processing | 박진구 |
2020-03 | Nanocatalyst-induced hydroxyl radical ((OH)-O-center dot) slurry for tungsten CMP for next-generation semiconductor processing | 박진구 |
2007-06 | Nanoparticle scanning and detection on flat and structured surfaces using fluorescence microscopy | 박진구 |
2012-07 | Nanoscale Particle Removal Using Wet Laser Shockwave Cleaning | 박진구 |
2005-10 | Nanoscale Particles Removal on an Extreme Ultra-Violet Lithography(EUVL) Mask Layer by Lasershock Cleaning | 박진구 |
2001-07 | Nanotribological Characterization of Fluorocarbon Thin Film by Plasma Enhanced CVD | 박진구 |
2002-03 | Next Generation Scratch and Corrosion Free Conditioner for Chemical Mechanical Planarization | 박진구 |
2009-11 | A novel approach for scratch detection and study on dependency of scratches during oxide CMP | 박진구 |
2017-10 | Novel method for nano-surface analysis of Cu CMP chemicals by AFM and microfluidic chip system | 박진구 |
2015-03 | Novel one-step route to induce long-term lotus leaf-like hydrophobicity in polyester fabric | 박진구 |
2010-05 | Numerical and Experimental Evaluation of Picoliter Inkjet Head for Micropatterning of Printed Electronics | 박진구 |
2013-04 | On the mechanism of material removal by fixed abrasive lapping of various glass substrates | 박진구 |
2013-04 | Optimal Pressure and Temperature Conditions for Deposition of FOTS Thin Films Suitable for Anti-Stiction Layers | 박진구 |
2010-12 | Optimization of CO 2 gas cluster generation for cleaning application | 박진구 |
2010-12 | Optimization of DIO 3with megasonic cleaning of Ru capped EUVL mask for effective carbon contaminant removal | 박진구 |
2005-11 | Optimizing the Plasma Deposition Process Parameters of Antistiction Layers using a DOE(Design of Experiment) | 박진구 |
2005-07 | Particle Adhesion and Removal on EUV Mask Layers During Wet Cleaning | 박진구 |
2017-12 | Particle Deposition and Adhesion | 박진구 |
2001-11 | Particle Removal and Its Mechanism on Hydrophobic Silicon Wafer in Highly Diluted NH4OH Solutions with an Added Surfactant | 박진구 |
2002-10 | Passivation and Etching of Wafer Surfaces in HF-H2O2-IPA Solutions | 박진구 |
2006-03 | PECVD를 이용한 금속 스탬프용 점착방지막 형성과 특성 평가 | 박진구 |
2001-11 | PECVD와 ICP에 의해 증착된 불화유기박막의 나노트라이볼러지 특성 비교분실 | 박진구 |
2003-04 | Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization | 박진구 |
2001-11 | Physical and Chemical Characterization of Recycled Oxide CMP Slurry | 박진구 |
2001-08 | Physical and chemical characterization of reused oxide Chemical Mechanical Planarization slurry | 박진구 |
2001-03 | Physical and Chemical Characterization of Reused Oxide Chemical Mechanical Planarization Slurry | 박진구 |
2002-11 | Point of Use Regeneration of Oxide Chemical Mechanical Planarization Slurry by Filterations | 박진구 |
2002-11 | Point of use regeneration of oxide chemical mechanical planarization slurry by filtrations | 박진구 |
2005-07 | Polishing Behavior and Characterization of Cu Surface in Citric Acid based Slurry with Corrosion Inhibitor(BTA) | 박진구 |