Novel method for nano-surface analysis of Cu CMP chemicals by AFM and microfluidic chip system

Abstract

A new method for nano-surface analysis with selective surface treatment is presented in this paper. With this method, the surface of interest is treated with chemicals selectively by using fluidics chip and boundaries of treated surface were analyzed by atomic force microscope. Through measuring the surface level relative to the untreated region, chemical-surface interactions could be assumed. Well-known Cu CMP slurry chemical components such as citric acid, hydrogen peroxide, and benzotriazole were treated on the copper surface with the above-mentioned experimental set, then the etch depth, grown/adsorbed layer thickness, and surface roughness were characterized by AFM measurement. © VDE VERLAG GMBH Berlin Offenbach