| 2008-05 | Effect of a guard-ring on the leakage current in a Si-PIN X-ray detector for a single photon counting sensor | 박진구 |
| 2010-12 | Effect of acoustic cavitation on dissolved gases and their characterization during megasonic cleaning | 박진구 |
| 2004-11 | The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal | 박진구 |
| 2012-07 | Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline Silicon | 박진구 |
| 2023-03-22 | Effect of ammonium halide salts on wet chemical nanoscale etching and polishing of InGaAs surfaces for advanced CMOS devices | 박진구 |
| 2000-01 | Effect of Chemicals and Slurry Particles on Chemical Mechamical Polishing of Polyimide | 박진구 |
| 2000-03 | Effect of chemicals and slurry particles on chemical mechanical polishing of polyimide | 박진구 |
| 2005-11 | Effect of Corrosion inhibitor, Benzotriazole(BTA), on Particle Adhesion in Cu CMP | 박진구 |
| 2008-01 | Effect of Corrosion Inhibitor, Benzotriazole, in Cu Slurry on Cu Polishing | 박진구 |
| 2006-12 | Effect of diamonds on pad recovery in oxide and metal pad conditioning process | 박진구 |
| 2010-04 | Effect of Different Deposition Mediums on the Adhesion and Removal of Particles | 박진구 |
| 2014-07 | Effect of dissolved gases in water on acoustic cavitation and bubble growth rate in 0.83 MHz megasonic of interest to wafer cleaning | 박진구 |
| 2021-02 | Effect of Dissolved Oxygen on Removal of Benzotriazole from Co during a Post-Co CMP Cleaning | 박진구 |
| 2014-12 | Effect of FOUP atmosphere control on process wafer integrity in sub20 nm device fabrication | 박진구 |
| 2013-12 | Effect of La doping of ceria abrasives for STI CMP | 박진구 |
| 2015-05 | Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation | 박진구 |
| 2008-12 | Effect of laser shock wave cleaning direction on particle removal behavior at trenchs | 박진구 |
| 2002-10 | The Effect of Mechanical Properties of Polishing Pads on Oxide CMP | 박진구 |
| 2009-02 | Effect of O-2 Pretreatment on Fluorinated Carbon Film Surfaces | 박진구 |
| 2002-03 | Effect of Organic Acids in Copper Chemical Mechanical Planarization Slurry on Slurry Stability and Particle Contamination on Copper Surfaces | 박진구 |
| 2018-10 | Effect of organic acids in dilute HF solutions on removal of metal contaminants on silicon wafer | 박진구 |
| 2008-12 | Effect of Ozone Supply Methods on PRE in Alkaline Ozone Solutions | 박진구 |
| 2014-12 | Effect of particle contamination on extreme ultraviolet (EUV) mask and megasonic cleaning process for its removal | 박진구 |
| 2007-10 | Effect of particle deposition and wet/dry cleaning methods on particle removal efficiency | 박진구 |
| 2016-06 | Effect of pH and chemical mechanical planarization process conditions on the copper-benzotriazole complex formation | 박진구 |
| 2009-01 | Effect of pH in Ru Slurry with Sodium Periodate on Ru CMP | 박진구 |
| 2006-12 | Effect of polish by-products on copper chemical mechanical polishing behavior | 박진구 |
| 2006-12 | Effect of poly silicon wettability on polymeric residue contamination | 박진구 |
| 2009-10 | Effect of Polysilicon Wettability on Polishing and Organic Defects during CMP | 박진구 |
| 2010-02 | Effect of Processing Parameters, Antistiction Coatings, and Polymer Type when Injection Molding Microfeatures | 박진구 |
