| 2020-10 | Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process | 박진구 |
| 2015-05 | Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size | 박진구 |
| 2017-12 | Conductive and transparent submicron polymer lens array fabrication for electrowetting applications | 박진구 |
| 2020-12 | Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process | 박진구 |
| 2009-10 | Convective Assembly and Dry Transfer of Nanoparticles Using Hydrophobic/Hydrophilic Monolayer Templates | 박진구 |
| 2011-12 | Correlation of polishing pad property and pad debris on scratch formation during CMP | 박진구 |
| 2017-10 | Critical dimension variation caused by wrinkle in extreme ultra-violet pellicle for 3-nm node | 박진구 |
| 2004-07 | Cu CMP에서 Large sized particles이 연마속도에 미치는 영향 | 박진구 |
| 2001-11 | Cu CMP에서 첨가제가 Polishing에 미치는 영향 | 박진구 |
| 2007-12 | Cu ECMP 공정에서 전해액이 연마거동에 미치는 영향 | 박진구 |
| 2005-11 | Cu Oxide와 Silicon Tip 사이의 나노트라이볼러지 작용 | 박진구 |
| 2004-12 | Cu post-CMP cleaning and the effect of additives | 박진구 |
| 2007-11 | Damage free particle removal from EUVL mask layers by high energy laser shock cleaning (LSC) | 박진구 |
| 2008-06 | Damage free particle removal from extreme ultraviolet lithography mask layers by high energy laser shock wave cleaning | 박진구 |
| 2005-06 | The Deposition and Characterization of 10nm Thick Teflon-like Anti-stiction Films for the Hot Embossing | 박진구 |
| 2006-12 | Deposition and characterization of antistiction layer for nanoimprint lithography by VSAM (Vapor Self Assembly Monolayer) | 박진구 |
| 2013-01 | Detection of Single Nucleotide Polymorphisms Using a Biosensor-Containing Titanium-Well Array | 박진구 |
| 2013-02 | Development of CO2 gas cluster cleaning method and its characterization | 박진구 |
| 2009-04 | Development of inlaid electrodes for whole column electrochemical detection in HPLC | 박진구 |
| 2009-12 | Development of large area CoNi alloy electrodeposition process for stress free electroforming mold | 박진구 |
| 2016-12 | Development of post InGaAs CMP cleaning process for sub 10nm device application | 박진구 |
| 2007-10 | Development of post Ru CMP cleaning solutions | 박진구 |
| 2015-08 | Dimensionally controlled complex 3D sub-micron pattern fabrication by single step dual diffuser lithography (DDL) | 박진구 |
| 2006-08 | Dishing and Erosion Evaluations of Tungsten CMP Slurry inthe Orbital Polishing Syste | 박진구 |
| 2008-05 | Effect of a guard-ring on the leakage current in a Si-PIN X-ray detector for a single photon counting sensor | 박진구 |
| 2010-12 | Effect of acoustic cavitation on dissolved gases and their characterization during megasonic cleaning | 박진구 |
| 2004-11 | The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal | 박진구 |
| 2012-07 | Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline Silicon | 박진구 |
| 2023-03-22 | Effect of ammonium halide salts on wet chemical nanoscale etching and polishing of InGaAs surfaces for advanced CMOS devices | 박진구 |
| 2000-01 | Effect of Chemicals and Slurry Particles on Chemical Mechamical Polishing of Polyimide | 박진구 |
