Repository at Hanyang UniversityCOLLEGE OF ENGINEERING SCIENCES[E](공학대학)MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)Articles
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Cu CMP에서 첨가제가 Polishing에 미치는 영향
- Title
- Cu CMP에서 첨가제가 Polishing에 미치는 영향
- Other Titles
- The Effects of Additives in Cu CMP Slurry on Polishing
- Author
- 박진구
- Issue Date
- 2001-11
- Publisher
- 한국재료학회(Materials Research Society of Korea)
- Citation
- 한국재료학회:학술대회논문집 2001, page. 80-80
- URI
- http://www.koreascience.kr/article/CFKO200111920969826.pagehttps://repository.hanyang.ac.kr/handle/20.500.11754/161425
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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