Investigation of hygroscopic properties in electronic packages using molecular dynamics simulation
- Title
- Investigation of hygroscopic properties in electronic packages using molecular dynamics simulation
- Author
- 김학성
- Keywords
- Hygroscopic characteristic; Swelling; Molecular dynamics
- Issue Date
- 2011-07
- Publisher
- ELSEVIER SCI LTD
- Citation
- In Polymer, 2011, 52(15), P.3437-3442
- Abstract
- Moisture-induced package failures such as interfacial delamination and pop-corn cracking are common failure phenomena that occur during the solder reflow process in the semiconductor industry. Therefore, the hygroscopic properties of the package materials are crucial factors in the reliability of electronic packaging products. In this work, molecular dynamics (MD) simulation was performed to study the hygroscopic properties, including diffusivity and swelling strain, of epoxy materials with respect to temperature and moisture concentration. Hygroscopic material properties predicted by MD are discussed and compared with the experimental data.
- URI
- http://www.sciencedirect.com/science/article/pii/S0032386111004630
- ISSN
- 0032-3861
- DOI
- 10.1016/j.polymer.2011.05.056
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
- Files in This Item:
There are no files associated with this item.
- Export
- RIS (EndNote)
- XLS (Excel)
- XML