Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김학성 | - |
dc.date.accessioned | 2018-03-13T06:43:22Z | - |
dc.date.available | 2018-03-13T06:43:22Z | - |
dc.date.issued | 2011-07 | - |
dc.identifier.citation | In Polymer, 2011, 52(15), P.3437-3442 | en_US |
dc.identifier.issn | 0032-3861 | - |
dc.identifier.uri | http://www.sciencedirect.com/science/article/pii/S0032386111004630 | - |
dc.description.abstract | Moisture-induced package failures such as interfacial delamination and pop-corn cracking are common failure phenomena that occur during the solder reflow process in the semiconductor industry. Therefore, the hygroscopic properties of the package materials are crucial factors in the reliability of electronic packaging products. In this work, molecular dynamics (MD) simulation was performed to study the hygroscopic properties, including diffusivity and swelling strain, of epoxy materials with respect to temperature and moisture concentration. Hygroscopic material properties predicted by MD are discussed and compared with the experimental data. | en_US |
dc.description.sponsorship | This work was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF)(2011-0005110). | en_US |
dc.language.iso | en | en_US |
dc.publisher | ELSEVIER SCI LTD | en_US |
dc.subject | Hygroscopic characteristic | en_US |
dc.subject | Swelling | en_US |
dc.subject | Molecular dynamics | en_US |
dc.title | Investigation of hygroscopic properties in electronic packages using molecular dynamics simulation | en_US |
dc.type | Article | en_US |
dc.relation.no | 15 | - |
dc.relation.volume | 52 | - |
dc.identifier.doi | 10.1016/j.polymer.2011.05.056 | - |
dc.relation.page | 3437-3442 | - |
dc.relation.journal | POLYMER | - |
dc.contributor.googleauthor | Chang, Seung-Hwan | - |
dc.contributor.googleauthor | Kim, Hak-Sung | - |
dc.relation.code | 2011207744 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | kima | - |
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