DeformableandCovalentlyTetheredAllOrganicTransistorforHigh-reliabilityFoldableElectronics

Abstract

Foldableelectronicsareattractingattentioninthenextgenerationsuchasdisplaysandsensors.Ingeneral,integrateddeviceshavemulti-layeredstructureconsistingofdifferentmaterials.Thisindicatesmechanicalstresscanpropagateinbothbulkandinterfacialregions,leadingtointerfacialdelaminationandcohesivefailureofthebulk.Toimplementfoldabledevice,itisessentialtoensureremarkablemechanicalstabilityatbothfailurepoints.Here,weintroduceanovelmoleculardesignofdeformable-covalentlyattachableinterpenetratingpolymernetworks(DcA-IPNs).Theembeddednetworksinduceshort-rangeorderofpolymersandcanholdstrainedpolymerchains.Inaddition,unreactedsilanolgroupsofDcA-IPNsinthesurfacecanformcovalentbondsbetweenthelayers.Basedonthis,weimplementDcA-IPNs-basedfoldabletransistorthatexhibitshighdrivingstabilityagainstfold-inducedstress.Webelieveournovelapproachwillprovidenewinsightintofoldableelectronics.|폴더블전자소자는디스플레이및센서등활용분야가넓어차세대기술로서많은주목을받고있다.폴더블전자소자를구현하기이해서는소자를이루는소재자체가굽힘,접힘과같은외부기계적자극하에서도안정적이어야하며,다양한소자가다층구조로계면을갖게되면서소재간계면접합또한고려되어야한다.외부기계적힘의방향과크기에따라소재결함,계면결함모두유발할수있고,실제폴더블전자소자는동적인힘이작용하기때문에안정적인구동을위해서는소재자체기계적안정성과소재간계면안정성모두를고려해야한다.그러나선행연구는두결함을방지하기위한연구방법론이구분되어있고,적층구조를위해후속공정을진행할때내화학성에대한한계가존재했다. 이를보완하기위해본연구에서는트랜지스터의모든소재를고분자로구성하고,상호침투형네트워크를도입하여소재자체기계적안정성,소재간계면접합력및용매에대한내화학성을향상시킬수있는방법론을제시하고자한다.네트워크형성과정에서결정성을낮추고,비결정질에서의응집을유도하여소재자체기계적안정성을향상시킬수있다.또한,표면미반응Si-OH기를통해박막간강한공유결합을유도할수있다.이를기반으로반복적인기계적자극에도트랜지스터가안정적으로구동되는것을확인하였다. 단일층에만국한된것이아니라트랜지스터를구성하는모든층에전체적으로상호침투형네트워크를도입하여하나의유기네트워크를적용한첫사례이며,네트워크도입에따른성능저하를발견할수없어앞으로다양한폴더블전자소자응용분야에적용될수있을것으로기대된다.