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Fabrication of high-resolution conductive lines by combining inkjet printing with soft lithography

Title
Fabrication of high-resolution conductive lines by combining inkjet printing with soft lithography
Author
오제훈
Keywords
Inkjet printing; Soft lithography; High-resolution printing; Surface wettability contrast; UV treatment
Issue Date
2013-10
Publisher
ELSEVIER
Citation
MICROELECTRONIC ENGINEERING, v. 110, Page. 219-223
Abstract
In this study, an effective method to fabricate well-defined conductive lines with high resolution has been proposed by combining inkjet printing with soft lithography. Soft lithography techniques such as nanoimprint lithography for negative SU-8 patterns and micro-contact printing for hydrophobic fluorocarbon layer were used to create surface wettability contrasts so that the spreading of droplets was confined on a hydrophilic region surrounded by hydrophobic regions. Surface wettability contrasts were evaluated by water contact angle measurements, and the maximum contact angle difference between hydrophobic and hydrophilic surfaces was 104 degrees. With the help of such surface wettability contrasts and lift-off process for removing small amount of ink stains, well-defined inkjet-printed lines as narrow as 2.8 mu m can be successfully generated. The sintered Ag lines also show good electrical resistivity of 7.6 mu Omega.cm, 4.7 times as large as bulk Ag's resistivity. This combined approach can be used to fabricate high-quality, high-resolution electrodes in printed electronics applications. (C) 2013 Elsevier B.V. All rights reserved.
URI
https://www.sciencedirect.com/science/article/pii/S0167931713004073?via%3Dihubhttps://repository.hanyang.ac.kr/handle/20.500.11754/183662
ISSN
0167-9317;1873-5568
DOI
10.1016/j.mee.2013.04.004
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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