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dc.contributor.author정영대-
dc.date.accessioned2023-06-22T00:11:18Z-
dc.date.available2023-06-22T00:11:18Z-
dc.date.issued2018-04-
dc.identifier.citationPHYSICS OF PLASMAS, v. 25, NO. 4, article no. 044501, Page. 1.0-7.0-
dc.identifier.issn1070-664X;1089-7674-
dc.identifier.urihttps://aip.scitation.org/doi/10.1063/1.5026427en_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/181987-
dc.description.abstractThe influence of Landau damping on the spin-oriented collisional asymmetry is investigated in electron-hole semiconductor plasmas. The analytical expressions of the spin-singlet and the spin-triplet scattering amplitudes as well as the spin-oriented asymmetry Sherman function are obtained as functions of the scattering angle, the Landau parameter, the effective Debye length, and the collision energy. It is found that the Landau damping effect enhances the spin-singlet and spin-triplet scattering amplitudes in the forward and back scattering domains, respectively. It is also found that the Sherman function increases with an increase in the Landau parameter. In addition, the spin-singlet scattering process is found to be dominant rather than the spintriplet scattering process in the high collision energy domain. Published by AIP Publishing.-
dc.description.sponsorshipNational Research Foundation of Korea (NRF) - Korean Government (MISP) NRF-2016R1A2B4011356-
dc.languageen-
dc.publisherAMER INST PHYSICS-
dc.titleCollisional spin-oriented Sherman function in electron-hole semiconductor plasmas: Landau damping effect-
dc.typeArticle-
dc.relation.no4-
dc.relation.volume25-
dc.identifier.doi10.1063/1.5026427-
dc.relation.page1.0-7.0-
dc.relation.journalPHYSICS OF PLASMAS-
dc.contributor.googleauthorLee, Myoung-Jae-
dc.contributor.googleauthorJung, Young-Dae-
dc.sector.campusE-
dc.sector.daehak과학기술융합대학-
dc.sector.department응용물리학과-
dc.identifier.pidydjung-
dc.identifier.article044501-
Appears in Collections:
COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E](과학기술융합대학) > APPLIED PHYSICS(응용물리학과) > Articles
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