SELECTIVE Cu ELECTRODEPOSITION ON MICROMETER TRENCHES USING MICROCONTACT PRINTING AND ADDITIVES
- Title
- SELECTIVE Cu ELECTRODEPOSITION ON MICROMETER TRENCHES USING MICROCONTACT PRINTING AND ADDITIVES
- Author
- 유봉영
- Keywords
- mu CP; selective Cu deposition; RDL; overburden; SAM(alkanethiol); Additives
- Issue Date
- 2021-04
- Publisher
- POLSKA AKAD NAUK
- Citation
- ARCHIVES OF METALLURGY AND MATERIALS, v. 66, NO 3, Page. 741-744
- Abstract
- Selective deposition was performed on a micrometer trench pattern using a microcontact printing (mu CP) process. Alkanethiols required for selective deposition were analyzed according to the carbon chain by linear sweep voltammetry (LSV). According to the LSV analysis, the effect of inhibiting Cu deposition depending on the length of the carbon chain was observed. During the Cu electrodeposition, the trench could be filled without voids by additives (PEG, SPS, JGB) in the plating solution. A mu CP process suppressing the deposition of the sample was used for selective Cu electrodeposition. However, there was oxidation and instability of the sample and 1-hexadecanethiol in air. To overcome these problems, the mu CP method was performed in a glove box to achieve effective inhibition.
- URI
- https://www.proquest.com/docview/2650309022?accountid=11283https://repository.hanyang.ac.kr/handle/20.500.11754/171731
- ISSN
- 17333490; 23001909
- DOI
- 10.24425/amm.2021.136372
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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