Adhesive-free bonding of PI/PDMS interface by site-selective photothermal reactions
- Title
- Adhesive-free bonding of PI/PDMS interface by site-selective photothermal reactions
- Author
- 최준명
- Keywords
- Adhesive-free bonding; Photothermal reaction; Polyimide; Polydimethylsiloxane; Biomedical device
- Issue Date
- 2021-12
- Publisher
- ELSEVIER
- Citation
- APPLIED SURFACE SCIENCE, Page. 1-10
- Abstract
- Effective bonding between polyimide (PI) and polydimethylsiloxane (PDMS) is important for the development of
both implanted and externally mounted biomedical devices; however, achieving an adhesive-free bonding be-
tween the two materials without using surface chemical treatments has been largely unsuccessful to date. We
discovered that, within a narrow range of laser parameters, laser-induced photothermal reactions at a specific
site on the PI/PDMS interface led to an unexpected reinforcement of the adhesion strength between the two
materials. This result was verified by microscopic in situ observations in which PDMS residues were observed to
remain on the PI surface after forced delamination. The effect of heat pulses on the PI/PDMS interface was
evaluated on the atomic scale through molecular dynamics simulations, and the results showed that as the heat
pulses were added, the roughness values of both the PI and PDMS surfaces increased, accompanied by an
improvement in the elastic properties at the interface, thus increasing the effective adhesion energy per unit area.
The incorporation of a scanning scheme enabled the continuous bonding of the two materials, demonstrating that
the proposed process can be easily scaled up for practical applications.
- URI
- https://www.sciencedirect.com/science/article/pii/S0169433221021796https://repository.hanyang.ac.kr/handle/20.500.11754/169467
- ISSN
- 0169-4332
- DOI
- 10.1016/j.apsusc.2021.151123
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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