Highly Integrated Guidewire Ultrasound Imaging System-on-a-Chip
- Title
- Highly Integrated Guidewire Ultrasound Imaging System-on-a-Chip
- Author
- 임재명
- Keywords
- Capacitive micromachined ultrasound transducer (CMUT); intravascular ultrasound (IVUS); quadrature sampling; ultrasound (US) imaging
- Issue Date
- 2020-01
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Citation
- IEEE JOURNAL OF SOLID-STATE CIRCUITS, v. 55, no. 5, page. 1310-1323
- Abstract
- In this article, we present a highly integrated guidewire ultrasound (US) imaging system-on-a-chip (GUISoC) for vascular imaging. The SoC consists of a 16-channel US transmitter (Tx) and receiver (Rx) electronics, on-chip power management IC (PMIC), and quadrature sampler. Using a synthetic aperture imaging algorithm, a Tx/Rx pair, connected to capacitive micromachined ultrasound transducers (CMUTs), can be activated at any time. The Tx generates acoustic waves by driving the CMUT, while the Rx picks up the echo signal and amplify it to be delivered through an interconnect that is driven by a buffer. On-chip logic controls the pulsers that generate the high-voltage (HV)-pulse for Tx. An on-chip PMIC provides 1.8-, 5-, 39-, and 44-V supplies and a clock signal from the two interconnects besides GND. A quadrature sampler down-converts the Rx echo signal to baseband, reducing its bandwidth requirement for the output interconnect. The system design, including transimpedance amplifier (TIA) optimization, based on the equivalent circuit of a specific CMUT is presented. The SoC was fabricated by a 0.18- $\mu \text{m}$ HV CMOS process, occupying 1.5-mm(2) active area and consuming 25.2 and 44 mW from 1.8 to 44 V supplies, respectively. The US Tx and Rx show bandwidths of 32-42 and 32.7-37.5 MHz, respectively. The input-referred noise of the system was measured as 9.66 nA in band with 2-m-long 52 American Wire Gauge (AWG) wire interconnects. The functionality of the GUISoC was verified in vitro by imaging wire targets.
- URI
- https://ieeexplore.ieee.org/document/8976311https://repository.hanyang.ac.kr/handle/20.500.11754/169074
- ISSN
- 0018-9200; 1558-173X
- DOI
- 10.1109/JSSC.2020.2967551
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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