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dc.contributor.author임재명-
dc.date.accessioned2022-03-15T00:23:29Z-
dc.date.available2022-03-15T00:23:29Z-
dc.date.issued2020-01-
dc.identifier.citationIEEE JOURNAL OF SOLID-STATE CIRCUITS, v. 55, no. 5, page. 1310-1323en_US
dc.identifier.issn0018-9200-
dc.identifier.issn1558-173X-
dc.identifier.urihttps://ieeexplore.ieee.org/document/8976311-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/169074-
dc.description.abstractIn this article, we present a highly integrated guidewire ultrasound (US) imaging system-on-a-chip (GUISoC) for vascular imaging. The SoC consists of a 16-channel US transmitter (Tx) and receiver (Rx) electronics, on-chip power management IC (PMIC), and quadrature sampler. Using a synthetic aperture imaging algorithm, a Tx/Rx pair, connected to capacitive micromachined ultrasound transducers (CMUTs), can be activated at any time. The Tx generates acoustic waves by driving the CMUT, while the Rx picks up the echo signal and amplify it to be delivered through an interconnect that is driven by a buffer. On-chip logic controls the pulsers that generate the high-voltage (HV)-pulse for Tx. An on-chip PMIC provides 1.8-, 5-, 39-, and 44-V supplies and a clock signal from the two interconnects besides GND. A quadrature sampler down-converts the Rx echo signal to baseband, reducing its bandwidth requirement for the output interconnect. The system design, including transimpedance amplifier (TIA) optimization, based on the equivalent circuit of a specific CMUT is presented. The SoC was fabricated by a 0.18- $\mu \text{m}$ HV CMOS process, occupying 1.5-mm(2) active area and consuming 25.2 and 44 mW from 1.8 to 44 V supplies, respectively. The US Tx and Rx show bandwidths of 32-42 and 32.7-37.5 MHz, respectively. The input-referred noise of the system was measured as 9.66 nA in band with 2-m-long 52 American Wire Gauge (AWG) wire interconnects. The functionality of the GUISoC was verified in vitro by imaging wire targets.en_US
dc.description.sponsorshipThis work was supported in part by the National Institute of Biomedical Imaging and Bioengineering (NIBIB) under Award R21 EB017365-02 and in part by the National Institute of Neurological Disorders and Stroke under Award R21NS108391.en_US
dc.language.isoenen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.subjectCapacitive micromachined ultrasound transducer (CMUT)en_US
dc.subjectintravascular ultrasound (IVUS)en_US
dc.subjectquadrature samplingen_US
dc.subjectultrasound (US) imagingen_US
dc.titleHighly Integrated Guidewire Ultrasound Imaging System-on-a-Chipen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/JSSC.2020.2967551-
dc.relation.journalIEEE JOURNAL OF SOLID-STATE CIRCUITS-
dc.contributor.googleauthorLim, Jaemyung-
dc.contributor.googleauthorTekes, Coskun-
dc.contributor.googleauthorArkan, Evren F.-
dc.contributor.googleauthorRezvanitabar, Ahmad-
dc.contributor.googleauthorDegertekin, F. Levent-
dc.contributor.googleauthorGhovanloo, Maysam-
dc.relation.code2020052598-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentSCHOOL OF ELECTRONIC ENGINEERING-
dc.identifier.pidlimjm-
dc.identifier.orcidhttps://orcid.org/0000-0002-1073-1304-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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