In-Situ공정으로 제조된 복합 솔더의 신뢰성

Abstract

In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu_6Sn_5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM(ball limiting metallurgy) interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.