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A New Wrapped Core Linking Module for SoC Testing

Title
A New Wrapped Core Linking Module for SoC Testing
Author
박성주
Issue Date
2001-11
Publisher
대한전자공학회
Citation
대한전자공학회 기타 간행물, v. 1, page. 137-142
Abstract
For a System-on-a-Chip(SoC) comprised of multiple IP cores with IEEE 1149.1 boundary scan design, various design techniques have been proposed to provide diverse test link configurations. In this paper, we present a new design of Wrapped Core Linking Module(WCLM) that enables systematic integration of 1149.1 JTAG'd cores and PI500 wrapped cores. The design preserves compatibility with standards and scalablity for hierarchical access.
URI
https://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE02012649?https://repository.hanyang.ac.kr/handle/20.500.11754/161039
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ETC[S] > 연구정보
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