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dc.contributor.author박성주-
dc.date.accessioned2021-03-31T04:20:15Z-
dc.date.available2021-03-31T04:20:15Z-
dc.date.issued2001-11-
dc.identifier.citation대한전자공학회 기타 간행물, v. 1, page. 137-142en_US
dc.identifier.urihttps://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE02012649?-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/161039-
dc.description.abstractFor a System-on-a-Chip(SoC) comprised of multiple IP cores with IEEE 1149.1 boundary scan design, various design techniques have been proposed to provide diverse test link configurations. In this paper, we present a new design of Wrapped Core Linking Module(WCLM) that enables systematic integration of 1149.1 JTAG'd cores and PI500 wrapped cores. The design preserves compatibility with standards and scalablity for hierarchical access.en_US
dc.language.isoen_USen_US
dc.publisher대한전자공학회en_US
dc.titleA New Wrapped Core Linking Module for SoC Testingen_US
dc.typeArticleen_US
dc.relation.journal전자공학회논문지-
dc.contributor.googleauthorSong, Jaehoon-
dc.contributor.googleauthorYi, Hyunbin-
dc.contributor.googleauthorYang, JoonSik-
dc.contributor.googleauthorPark, Sungju-
dc.relation.code2012101087-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF COMPUTING[E]-
dc.sector.departmentDIVISION OF COMPUTER SCIENCE-
dc.identifier.pidpaksj-
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