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Progress in the field of micro-electrocorticography

Title
Progress in the field of micro-electrocorticography
Author
정예환
Keywords
electrocorticography; ECoG; micro-electrocorticography; mu ECoG; neural electrode array; neural interfaces; electrophysiology; brain-computer interface; in vivo imaging; tissue response; graphene
Issue Date
2020-01
Publisher
MDPI
Citation
MICROMACHINES, v. 10, no. 1, article no. 62
Abstract
Since the 1940s electrocorticography (ECoG) devices and, more recently, in the last decade, micro-electrocorticography (mu ECoG) cortical electrode arrays were used for a wide set of experimental and clinical applications, such as epilepsy localization and brain-computer interface (BCI) technologies. Miniaturized implantable mu ECoG devices have the advantage of providing greater-density neural signal acquisition and stimulation capabilities in a minimally invasive fashion. An increased spatial resolution of the mu ECoG array will be useful for greater specificity diagnosis and treatment of neuronal diseases and the advancement of basic neuroscience and BCI research. In this review, recent achievements of ECoG and mu ECoG are discussed. The electrode configurations and varying material choices used to design mu ECoG arrays are discussed, including advantages and disadvantages of mu ECoG technology compared to electroencephalography (EEG), ECoG, and intracortical electrode arrays. Electrode materials that are the primary focus include platinum, iridium oxide, poly(3,4-ethylenedioxythiophene) (PEDOT), indium tin oxide (ITO), and graphene. We discuss the biological immune response to mu ECoG devices compared to other electrode array types, the role of mu ECoG in clinical pathology, and brain-computer interface technology. The information presented in this review will be helpful to understand the current status, organize available knowledge, and guide future clinical and research applications of mu ECoG technologies.
URI
https://www.mdpi.com/2072-666X/10/1/62https://repository.hanyang.ac.kr/handle/20.500.11754/160593
ISSN
2072-666X
DOI
10.3390/mi10010062
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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