대한전자공학회 종합 학술 대회 논문집 (하계) 2001, Vol.2 : 반도체 소사이어티, v. 24, no. 1, page. 133-136
Abstract
A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package.