FCVA 방법으로 증착된 DLC 박막의 열처리에 따른 구조적, 전기적 물성 분석

Abstract

Effects of thermal treatment on the structural and electrical properties of DLC films have been studied. The DLC films were deposited by using a modified FCVA system as a function of negative substrate bias voltage, deposition time, and nitrogen flow rate. The thermal treatment on DLC films could be achieved byperforming the RTA process at 600°C, 2min. Structural investigation on the thermal treatment effect was evaluated by inspecting the Raman spectroscopy, XPS, AFM, and internal compressive stress. In addition, the electrical properties of DLC films were evaluated by using the high current source and Lab-View data acquisition system. As the result of RTA treatment, sp3/sp2 ratio and internal compressive stress of the DLC films were decreased from 5% to 22% and from lGPa to 3GPa, and the Id/ I g intensity ratios was increased from 0.19 to ᄋ.35. It was also found that the variation of internal stress of DLC films strongly agree with the variation of sp3/sp2 fraction and Id/ I g intensity ratio.