Analytical Signal Integrity Verification Models for Inductance-Dominant Multi-Coupled VLSI Interconnects
- Title
- Analytical Signal Integrity Verification Models for Inductance-Dominant Multi-Coupled VLSI Interconnects
- Author
- 심종인
- Issue Date
- 2002-04
- Publisher
- IEEE/ACM
- Citation
- International Workshop on System Level Interconnect Prediction, page. 61-68
- Abstract
- Novel signal integrity verification models for inductancedominant RLC interconnect lines are developed by using a
traveling-wave-based waveform approximation (TWA) technique. The multi-coupled line responses are decoupled into
the eigenmodes of the system in order to exploit the TWA
technique. Then, the response signals are mathematically
represented by the linear combination of each eigenmode
response based on TWA, followed by reporting the signal
integrity models for the multi-coupled lines. The signal
integrity of VLSI circuit interconnects has a strong correlation with input signal switching-patterns in the multiple
lines. With the proposed analytic signal integrity models,
the switching-dependent signal delay, crosstalk, ringing, and
glitches of the inductance-dominant RLC interconnect lines
can be accurately as well as efficiently determined. It is
shown that the models have excellent agreement with SPICE
simulations.
- URI
- https://dl.acm.org/doi/abs/10.1145/505348.505361?https://repository.hanyang.ac.kr/handle/20.500.11754/157248
- ISBN
- 978-1-58113-481-0; 1-58113-481-9
- DOI
- 10.1145/505348.505361
- Appears in Collections:
- COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E](과학기술융합대학) > PHOTONICS AND NANOELECTRONICS(나노광전자학과) > Articles
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