Deposition of Cu-Ni films by magnetron co-sputtering and effects of target configurations on film properties
- Title
- Deposition of Cu-Ni films by magnetron co-sputtering and effects of target configurations on film properties
- Author
- 박진석
- Keywords
- Cu-Ni alloy; co-sputtering; target configuration; structural and electrical properties
- Issue Date
- 2003-02
- Publisher
- 대한전기학회
- Citation
- KIEE International Transactions on Electrophysics and Applications. v.3-C, no.1, Page.23-27
- Abstract
- Structural properties of Cu-Ni alloy films, such as preferred orientation, crystallite size, inter-planar spacing, cross-sectional morphology, and electrical resistivity, are investigated in terms of target configurations that are used in the film deposition by means of magnetron co-sputtering. Two different target configurations are considered in this study: a dual-type configuration in which two separate targets (Cu and Ni) and different bias types (RF and DC) are used and a Ni-on-Cu type configuration in which Ni chips are attached to a Cu target. The dual-type configuration appears to have some advantages over the Ni-on-Cu type regarding the accurate control of atomic composition of the deposited Cu-Ni alloy. However, the dual-type-produced film exhibits a porous and columnar structure, the relatively large internal stress, and the high electrical resistivity, which are mainly due to the relatively low mobility of adatoms. The affects of thermal treatment and deposition conditions on the structural and electrical properties of dual-type Cu-Ni films are also discussed.
- URI
- http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE01315235?https://repository.hanyang.ac.kr/handle/20.500.11754/154973
- ISSN
- 1598-2610
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
- Files in This Item:
There are no files associated with this item.
- Export
- RIS (EndNote)
- XLS (Excel)
- XML