새로운 금속 전사 프린팅법을 이용한 TFT 제작에 관한 연구

Abstract

We report a new metal transfer printing method that uses a water-mediated transfer. A metal thin film is used as a solid "ink", which easily releases from a self-assembled monolayer-coated glass pad and is transferred to a Si substrate using elastomeric stamp during water-mediated metal transfer printing. A layer of water on the substrate facilitates surface bonding between the metal thin film and the Si substrate. This method can be adopted in automated printing machines that are used to generate metal patterns with a wide range of feature sizes. Metal patterns transferred using the method were used as metal electrodes for ZnO-based thin-film transistors, with a maximum field effect mobility of 7.1cm²/V s, operating at 5 V with an on/off current ratio of ∼10⁴.